Ansoft TPA

TPA fully characterizes an entire package structure and automatically produces lumped or distributed RLC (Resistance, Inductance, and Capacitance) values for any lead or coupled groups of leads in matrix format or in SPICE sub-circuit format.

These models can be generated directly from package layout tools coming from Synopsys, Cadence and Zuken, and exported into existing SPICE tools (SPICE/IBIS format) for subsequent timing analyses.